The wireless technology company Option announced the development of a new 3.5G HSPA (high speed packet access) embedded module for Intel’s next generation Mobile Internet Device (MID) platform. The module will be used on Intel’s Moorestown platform, which is based on the Intel Atom (TM) processor.

"With Moorestown, Intel is continuing their proud tradition of delivering on Moore's law by increasing processing speed and functionality while significantly reducing footprint and power consumption," said Jan Callewaert, CEO of Option. "Option's continued innovation with the new 3.5G HSPA embedded module will bring leading edge wireless connectivity to Intel's next generation Moorestown platform," he added.

Option's GTM501 measures only 25 x 30 x 2.5 mm, making it the smallest HSPA module in the world.

Anand Chandrasekher, Intel Corporation Senior Vice President and General Manager for the company's UltraMobility Group, explained that a high performance wireless connectivity is mandatory for the success of Mobile Internet Devices. He added that "Option's expertise and experience with HSPA modules combined with Intel's innovation in delivering high performance and low power solutions, will help enable next generation Moorestown platforms to be always connected."

MIDs represent the newest category of portable Web-centric devices, used by consumers and also business professionals in many of their activities, such as entertainment, access certain information or online gaming, providing a great on-the-go solution. The market is constantly growing and ABI Research estimated that it will reach close to 200 million units a year by 2013.

Moorestown is scheduled for release sometime at the end of 2009 or even early 2010 and the new chips are expected to have a significantly lower power consumption than Intel’s current MIDs Atom chips.