Intel Corporation and Ericsson have been working together, developing a solution to bring High-Speed Packet Access (HSPA) to mobile internet devices. Monday, at the Intel Developer Forum, Intel executive Chandrasekher demonstrated the world’s first working ‘Moorestown’ HSPA platform. Ericsson also took the occasion to announce they would extend their 3G mobile broadband access to cover not just notebooks but many other devices as well.

Anand Chandrasekher, Intel’s senior vice president and Ultra Mobility Group general manager spoke at length about the progress Chipzilla is making in the mobile internet device market, and made a practical demonstration of the Moorestown platform at work.

Moorestown is made up a System On a Chip (SOC), code named ‘Lincroft’ – which includes a 45 nm microprocessor, graphics, a memory controller and a video encoder/decoder, all on a single chip – and an I/O hub called ‘Langwell’, which connects I/O ports with wireless, storage and display components, to connect the platform to mobile devices, as well as a few board level functions.

Chandrasekher boasted that Moorestown is the first step in bringing the “full internet experience” to the smartphone market. He went on to explain that Moorestown platforms would support such technologies as 3G, WiMax, Wi-Fi, GPS, Bluetooth and TV.

Intel says it intends to use Moorestown as a replacement for its Atom series of ultraportable processors, saying that the former would bring idle power consumption down by more than ten times, compared to that of earlier mobile devices equipped with the latter.

Chandrasekher, reffering to Intel’s partnership with Ericsson, said that HSPA data modules, measuring 25×30×2.x mm, and optimized for the Moorestown platform would be released by 2009/2010.