According to agreements, these companies will now include 32-nanometer (nm) bulk complementary metal oxide semiconductor (CMOS) process technologies and joint development of process design kits (PDKs) to support that technology. Building on the success of earlier joint development and manufacturing agreements at 90nm, 65nm and 45nm, alliance partners will be able to produce high-performance, energy-efficient chips at 32nm.

"IBM remains convinced that collaborative innovation in an open ecosystem of partners is the key to technology leadership, both now and in the years to come," said Michael Cadigan, general manager, semiconductor solutions, IBM Global Engineering Solutions. "Today’s announcement validates that strategy by meeting client requirements for leadership technology. With the extensions of our agreements to the 32nm generation -- including manufacturing and IBM Research to complement the proven joint development model in place for well over a decade -- IBM is working together with its alliance partners to deliver leading-edge technology that promises to dramatically change the way we live, work and play."

IBM, Chartered and Samsung, as Common Platform technology manufacturers, will be able to use the jointly developed 32nm process technology and design kits to synchronize their manufacturing facilities. This helps facilitate the flexibility to produce nearly identical chips for their respective high-volume OEM clients, who require a multi-sourcing model and expect early access to process technology.